Further It can also be used on the right side of the different tools by slight alterations Design Criteria: The Main Criteria for the design was the amount of space available in the Load lock chamber for mm diameter wafer to insert from the top surface.
A thorough study was done on all the Load locks of different Platform to analyze the Gap available between the mm wafer and the LL chamber Wall Analysis of different size and shapes of the Hoops were studied. This helped to identify how the Cassette can be oriented with respect to the Load Lock Gates for transferring the wafer Hoop Travel within the Pedestal gaps were analyzed to check amount of Hoop travel required to lift the Cassette to reach WTP The Challenge was to develop a Tool which can hold the mm wafer and have sufficient gap for adding O-ring for Vacuum Holding and to cater the heights of different wafer transfer plane scenarios.
The Next design challenge was the amount of force required to seal the Cassette under Vacuum. O-ring selection was a major concern. O-ring selected should be of Semiconductor grade and have suitable shore hardness.
Since Space was also constraint, decided to go with a smaller dia O-ring and the amount of force required was calculated for this Cross Section. New shape of the Custom size O-ring was achieved which has a odd shape to cater different tools High precision electric actuators which are vacuum compatible and are having minimum travel were selected. Pick and Place locking system provided on the Tool to ensure any operator can place the Cassette with ease and can be removed without any difficulty after process A Vacuum chamber with door to place the Tool was the next step.
This Vacuum chamber along with required components to make it modular, has done to locate it on different platform tools With the Force required to compress O-ring in Vacuum, Suitable Actuator required in order to compress the O-ring. Process parameters vary greatly for different polymer materials and substrates so there are no fixed rules for spin coat processing, and machines must retain programming flexibility to account for different wafer sizes, materials, substrates and the desired thickness of the resist.
General principles of spin coating however, obey these trends:. Controlling carefully the speed and acceleration of wafer spinning along with the precise application and positioning of dispense of the resist material, exhaust conditions, acceleration during the spin process is what produces the high uniformity, low waste, and speed of operation that is goal over every wafer spin coating process.
The uniformity must be excellent within the wafer and wafer to wafer. Fab managers need to juggle many competing factors in their choice of spin coater-developer equipment for the fab floor.
Often the lithographic cluster is composed of several machines, all with their own special wafer processing. In other cases where space and investment dollars are of more concern, lithographic processes can be integrated providing more efficiency at less cost.
Either way there are a few things of primary concern to facility managers when looking at spin coating equipment for a lithographic cluster. Reliability is a function of the ruggedness of the mechanics, the robustness of the electronic components and interconnects, as well as the maturity, elegance and simplicity of the control system software. When all of these factors are combined with careful assembly, test and verification, the result is a highly reliable tool.
The motion speeds of the robotics need to be sustainably high but are not critical if the robot is not a limiting factor. The number of process resources required such as spinners and thermal modules will be a function of process times in each module balanced among the resources.
All of this in a system of minimum footprint to conserve expensive clean room spaces, which often means that systems resources must be arrayed in vertical stacks wherever possible.
Layout design must allow for reasonable access to maintainable subsystems so that both preventative and corrective maintenance can carried out. Unique maintenance features of the S3 Spin Coater design include:. Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2 minutes. By using the LatticeAx base platform, every user can cleave samples with wide variation in size, thickness and materials at high quality within 2 minutes.
It uses precision knobs to produce fine, reproducible surface indentation followed by slow, controlled cleaving. Combine this tool with your own optical microscope to improve cleaving accuracy.
The addition of high magnification imaging enables accurate indenting, resulting in samples cleaved with high accuracy. It integrates the patent pending LatticeAx base with an industrial platform customized for indenting and cleaving. The imaging package includes a focusing mount, a digital microscope with polarizer and real-time image acquisition and display software. With realtime imaging the indent is placed accurately with respect to the target making cleaving sample target simple and fast for all users.
The accepts samples with a wide range of sizes, thicknesses and materials. It can indent and cleave cleanly, not generating excessive silicon dust and resulting in clean edges. Because of the accuracy of the indent die can be excised without loss of material. LatticeAx is Electron Microscopy Sciences' highest performance cleaving solution. This dedicated cleaving workstation is used to survey, align, micro-indent, cleave, and inspect any sample by any user.
The package also integrates a robust, coarse and fine focusing mount and fiber optic ring lighting. Using the cleaving bar and turning knob, cleave slowly and controllably perpendicular to the primary sample axis, from the indentation. Simple mechanics make the SSC an important addition to the cross section sample preparation workflow.
Using simple mechanics, the Small Sample Cleaver SSC uses a novel sample holder and a cleaving platform to safely cleave samples into chips as small as 2 x 2 mm. The novel sample holder allows samples from mm to be held during indenting and cleaving. No more handling samples directly with fingers.
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